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- Manufacturer: Bostik, Inc.
- Product Line: Bostik MRO Adhesives
- Product: Thermogrip® Hot Melt Glue Sticks
- Industries: Elastomers | Facility Infrastructure | Maintenance, Repair, Overhaul | Metal Processing & Fabrication | Transportation
- Authorized Countries: United States
Thermogrip® 2109
Fulfilled By ChemPoint
Hot-melt adhesive designed for use on porous substrates including paper, cardboard, and wood.
Quantity
Documents
Specifications
Color: Tan
Size (dia. x length):
1/2" x 10"
1" x 3"
Tensile Strength/Elongation: 520 psi/200%
Softening Point: 206°F (97°C)
Specific Gravity, gms/cc: 0.95
Viscosity, cps:
@250°F (121°C) 19,800
@300°F (149°C) 7,375
@350°F (177°C) 2,700
@400°F (205°C) 1,700
Open Time: Medium (10 to 30 seconds)
Temperature Resistance: -10°F to 165°F (-23°C to 74°C);
Manufacturer
Product Line
Product
Industries
Authorized Countries
United States
Overview
Thermogrip® 2109 2109 glue stick is an economical hot-melt adhesive engineered for porous substrates including paper, cardboard, and wood products.
Features & Benefits
- Economical with low viscosity and quick grab ability
- Very good "gunability" in stick form
- Performs well at application temperatures as low as 300°F
Problems Solved
Poor Glue Stick Thermal Performance
Poor Surface Bonding
Applications
Corrugated and packaging applications.
Apply 2109 between 300°F to 400°F to many other porous substrates including wood and some foams.
Used in "stand-by" applications as backup to automated packaging systems.
Economical hot melt for wood bonding
Related Applications
Maintenance, Repair, Overhaul
Related Chemistries
Maintenance, Repair, Overhaul
Related End Markets
Elastomers
Facility Infrastructure
Maintenance, Repair, Overhaul
- Consumer Products
- Electronics
- Food & Beverage
- General Industrial
- Heavy Industry
- Personal Care
- Pulp & Paper
- Wood Products
Related Functions
Maintenance, Repair, Overhaul
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