Ashland

Optiphen™

Key Applications

Hair Care; Skin Care

Product Description

This combination of phenoxyethanol and an emollient base provides optimized protection against microbial growth from bacteria and yeast while giving the finished product exceptional feel.

Grades

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namekey propertiesdocumentation
Optiphen® BSPOptiphen® BSP is a combination of Benzoic and Sorbic acids in Phenoxyethanol. It conforms to the recommendations for Natural Cosmetic Products including Conseil de l’Europe. Due to the organic acids, Optiphen® BSP/Rokonsal™ BSP may be classified as a “mild preservative,” provided the pH of the final product is not higher than 5. It is effective against Gram-positive and Gram-negative bacteria, yeaSDS*TDS*
NDOptiphen® ND is a combination of Benzoic acid and Dehydroacetic acid in Phenoxyethanol. Optiphen® ND does not contain halo-organic components, formaldehyde or any formaldehyde-releasers. It is effective against Gram-positive and Gram-negative bacteria, yeast, and mold. Due to the organic acids, Optiphen® ND can be classified as a “mild preservative,” provided the pH of the final product is not higSDS*TDS*
OptiphenOptiphen® is a unique liquid preservative formulation which consists of phenoxyethanol and an emollient base. SDS*TDS*
Optiphen BSB-N PreservativesOptiphen® BSB-N is a combination of Benzoic and Sorbic acids in Benzyl alcohol. The ingredients of Optiphen® BSB-N conform to the German BDIH-recommendation for Natural Cosmetic Products and the recommendations of the Conseil de l’Europe. Due to the organic acids, Optiphen® BSB-N may be classified as a “mild preservative,” provided the pH of the final product is not higher than 5. SDSTDS*
PlusOptiphen® Plus is a patent-pending liquid preservative formulation featuring an innovative blend of Phenoxyethanol and Sorbic acid in an emollient base of Caprylyl Glycol. It is ideal for slightly acidic personal care products requiring broad spectrum protection. The combination of all three ingredients offers effective protection against bacteria, yeast, and mold growth while imparting emolliencySDS*TDS*