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UCON™ Polyalkylene Glycol Solder Assist Fluids

Key Applications

printed circuit board manufacturing and assembly and flux fluids

Product Description

These fluids have excellent thermal and oxidative stability, making them ideal for printed circuit board manufacturing and assembly.

Grades

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namekey propertiesdocumentation
10 High flash point, water soluble, PAG based fluid with good inherent thermal stability and good water washability. Suitable as component in solder reflow fluids, fluxes and fusing fluids. SDS TDS
26 Low viscosity, water soluble PAG, additive improves stability at high temperatures and raises its flash point. Suitable as component in solder reflow fluids, fluxes and fusing fluids. SDS TDS
25 Low viscosity, water soluble PAG, good thermal stability and water washability. Suitable as component in solder reflow fluids, fluxes and fusing fluids. SDS TDS
24 Medium viscosity, PAG, excellent thermal stability and water washability. Suitable as component in solder reflow fluids, fluxes and fusing fluids. SDS TDS