MOR-AD™
Dow

MOR-AD™

Key Applications

Paper, PP, Metal

Product Description

These solvent-free, waterborne, and polypropylene bonding adhesives are typically used for splicing paper to paper and providing excellent adhesion of polypropylene to metal substrates.

Grades

* Contact Us For Information

namekey propertiesdocumentation
MOR-AD™ M-119 SDS* TDS
MOR-AD™ M-119C SDS* TDS
MOR-AD™ M-800 SDS* TDS*
MOR-AD™ M-805 SDS* TDS