UCON™ Polyalkylene Glycol Solder Assist Fluids
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UCON™ Polyalkylene Glycol Solder Assist Fluids

Key Applications

printed circuit board manufacturing and assembly and flux fluids

Product Description

These fluids have excellent thermal and oxidative stability, making them ideal for printed circuit board manufacturing and assembly.

Grades

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namekey propertiesdocumentation
UCON™ 10 Polyalkylene glycol solder assist fluid ideal for formulations used in printed circuit board manufacturing assembly. SDS TDS
UCON™ 24 ISO 100/150 Polyalkylene glycol fluid, created for use in solder reflow fluids, fluxes, fusing fluids, and other process fluids where high temperature stability and water solubility are critical. SDS TDS
UCON™ 25 ISO 100 Polyalkylene glycol fluid, designed for use in solder reflow fluids, fluxes, fusing fluids, and other process fluids needing high temperature stability. SDS TDS
UCON™ 26 ISO 100 Polyalkylene glycol fluid, designed for use in solder reflow fluids, fluxes, fusing fluids, and other process fluids needing high temperature stability. SDS TDS