Used in nondestructive leak and thermal shock testing for military electronics according to mil spec 883
A non-conductive, thermally and chemically stable fluid.
Ideal for a variety of applications such as etchers, ion implanters, testers and others.
• Compatible with most metals, plastics and elastomers.• Non-conductive• Narrow boiling range• Wide liquid range•Thermal stability•Chemical stability
• Appearance: Clear, colorless• Average Molecular Weight: 650• Boiling Point (1 atm): 165°C• Pour Point: -57°C• Latent Heat of Vaporization (at normal boiling point): 69 J/g• Liquid Density: 1855 kg/m3• Kinematic Viscosity: 2.2 centistokes• Absolute Viscosity: 4.1 centipoise• Liquid Specific Heat: 1100 J kg-1 °C-1• Liquid Thermal Conductivity : 0.062 W m-1 °C-1• Coefficient of Expansion: 0.0012 °C-1• Water Solubility: <7 ppmw• Solubility in Water: <5 ppmw• Ozone Depletion Potential: 0• Dielectric Strength: 46 kV, 0.1" gap• Dielectric Constant: 1.9
Designed for long-lasting high performance in heat transfer applications in wafer-fab equipment and for direct contact cooling with military grade electronics.
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