SP-1055 is a heat-reactive phenolic resin based on brominated octylphenol-formaldehyde. It is excellent for use in butyl rubbers and unsaturated elastomers.
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SP-1055 is a heat-reactive brominated phenolic resin that contains methylol groups. It allows a faster cure of butyl rubbers or other unsaturated elastomers without requiring halogen donors.
Brominated resins are especially useful for applications where the rubber may be exposed to heat or repeated use. SP-1055 prevents quick deterioration by curing or cross-linking.
SP-1055 is also used to cross-link elastomers in the manufacture of pressure-sensitive adhesives. It provides improved cohesive strength while imparting little color to the finished adhesive, allowing high-clarity film formation.
Physical form: Solid flakes
Specific gravity: 1.05
Softening point (ball and ring): 85°C–95°C
Methylol content: 10.0%–14.0%
Bromine content: 3.6%–4.0%
Primary Chemistry:
Brominated octylphenol-formaldehyde resin
Scorch safety issues with phenolic or other resins
Low cohesive strength or color changes while curing rubber adhesives
Butyl rubbers and unsaturated elastomers
Rubber and pressure-sensitive adhesives
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