SP-553 is a thermoplastic phenolic resin that is excellent for use as a tackifier in solventborne and hot-melt adhesives.
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SP-553 is an oil-soluble terpene phenolic resin specifically designed for use in solvent-based adhesive formulations. It is primarily used to increase the tackiness and retention of polychloroprene and SBR adhesives.
In polychloroprene adhesives and cement, SP-553 resin is used as a tackifier to improve the adhesive film's cohesive strength. It can also be used in the presence of magnesium oxides as it does not react with the compounds that typically reduce the tackiness of adhesives.
Physical form: Solid flakes
Specific gravity: 1.00
Softening point (ball and ring): 110°C–120°C
Color, Gardner, 50% in toluene: 0–10
Primary Chemistry: Terpene phenolic resin
Reduction of tackiness in adhesive films Compatibility issue of phenolic resins with solvent-based adhesives
Solventborne adhesives Hot-melt adhesives Polychloroprene and SBR adhesives Pressure-sensitive mastics
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