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PARALOID™ TMS-2672
PARALOID™ TMS-2672 is an MBS core-shell impact modifier that easily disperses and improves the brittle mechanical behavior of thermosetting resins while maintaining lightweight properties and improved adhesion.
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- Manufacturer: Dow
- Product Line: Dow PARALOID™ Impact Modifiers
- Product: PARALOID™ BTA Impact Modifiers
- Industries: Adhesives | Plastics
- Authorized Countries: Canada | United States
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Fulfilled By ChemPoint
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Canada
United States
Overview
PARALOID™ TMS-2672 is a patented MBS core-shell impact modifier designed to enhance the mechanical performance of thermosetting adhesives, especially epoxy and methyl methacrylate (MMA) systems. PARALOID™ TMS-2672 improves impact resistance, elongation at break, and fatigue strength while maintaining low viscosity and lightweight properties. This grade disperses quickly and uniformly in liquid-curable resins, making it ideal for structural adhesives used in demanding applications across automotive, aerospace, electronics, and marine industries.
Specifications
Form: Powder
Color: White
Bulk density aerated, g/cm³: 0.41 ± 0.10
Volatiles, % max: ≤1.0
Primary Chemistry:
Acrylic copolymer and alkylated phenol
Features & Benefits
- Fast and easy dispersion in epoxy and MMA adhesives
- Maintains low viscosity for efficient processing
- Enhances impact strength at ambient and low temperatures
- Increases elongation at break and fatigue resistance
- Improves adhesion to various substrates
- Retains glass transition temperature of the base resin
- Lightweight additive for structural applications
Problems Solved
Brittleness in thermoset adhesives Poor impact and tensile strength in epoxy and MMA systems Limited fatigue and elongation resistance in structural bonding applications Dispersion challenges in liquid-curable resins
Applications
Structural adhesives (epoxy and MMA) Fiberglass composite bonding Coating and casting adhesives Wind turbine blade bonding Automotive body panel adhesives Aerospace structural bonding Marine and recreational vehicle adhesives Electronics encapsulation and assembly
Related Applications
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Adhesives
Plastics
Related Processes
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years. By incorporating Dow PARALOID™ MBS Impact Modifiers, companies can increase capacity, transmission, and distribution of the existing electrical grid, as well as improve reliability and the ability to recover from outages.
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