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jER™ YX4000 is a highly adhesive, bisphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption, and rigidity against stress. It is used as the standard for EMC thin-package applications and electrical applications.
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jER™ YX4000 is a bisphenol-type solid epoxy resin made from the reaction of epichlorohydrin and tetramethyl bisphenol. It has a significantly low melt viscosity, low water absorption, and good adhesive and rigidity balance against stress, making it appropriate for applications such as electrical and electronic, thin-package EMC, potting and encapsulation materials, powder coatings for ship bottoms, adhesives, and composites. It also exhibits excellent abrasion, good adhesion, and heat, wear, water, and electrical resistance.
Epoxy equivalent weight (WPE): 180–192 g/eq
Melting point (°C): 108
Appearance: Yellow solid
Harsh hydrolyzable Cl: 400 ppm
Density at 25°C: 1.15 g/cm3
Cured State Properties:
Tg: 147°C
Elastic modulus @ 40°C: 1.6 GPa
Elastic modulus @ 250°C: 18 MPa
Coefficient of thermal expansion (α1): 70
Coefficient of thermal expansion (α2): 191
Td5: 372°C
Cured State Properties Formulation:
jER™ YX4000: 100 phr
Phenol novolac: 56 phr
Triphenylphosphine: 1 phr
Curing condition: 120°C/2 hr + 175°C/6 hr
CAS: 85954-11-6
Bisphenol-type solid epoxy resin
Abrasion, heat, and water resistance
Electrical insulation
Wear resistance
Significantly low melt viscosity
Low chlorine content
Low water absorption
Good balance between adhesiveness and rigidity against stress
Highly adhesive to metal, porcelain, and concrete
Damage to coatings caused by exposure to weather, chemicals, or water
Resin shifting or distortion from water
Cracking and surface defects of coatings used on flexible substrates
Compatible with metal, aluminum, concrete, masonry, glass, fibers, fabrics, plastics, steel, and ceramic
Electrical and electronic applications (EMC, solder resist, PCB)
Highly adhesive to metal, porcelain, and concrete
Potting and encapsulation materials
Powder coatings for ship bottoms
Adhesives
Composites
Thin-package EMC as de facto standard
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