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jER™ YX7110 is a tough, flexible liquid-type epoxy resin used for coatings, adhesives, composites, and potting and encapsulation materials. It exhibits excellent insulation, flexibility, and resistance to cracking, impact, heat, water, and chemicals.
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jER™ YX7110 is a liquid-type epoxy resin formed from reacting epichlorohydrin and an aliphatic and aromatic polyol that can be used as an impact modifier for brittle materials and stress relaxation to avoid cracking and warpage. It contributes flexibility, insulation, heat resistance, chemical resistance, and excellent wear and abrasion resistance when used in a variety of applications, including coatings, adhesives, composites, potting and encapsulation materials, base films/sheets for wearable devices, impact modifiers, and stress-relaxer additives.
Epoxy equivalent weight (WPE): 800–1200 g/eq
Appearance: Colorless semisolid
Viscosity at 50°C: 2700 P
SAP Cl: 50 ppm
Density at 25°C: 1.2 kg/m3
Cured State Properties:
Tg: 25°C
Td5: 342°C
Tensile modulus: 6.8 MPa
Tensile strength: 12.3 MPa
Tensile elongation: 234 MPa
Cured State Properties Formulation:
jER™ YX7110: 100 phr
Bisphenol A novolac: 25 phr
2-Ethyl-4-methylimidazole: 0.05 phr
Curing condition: 170°C/1 hr + 180°C/1 hr
Damage to coatings caused by exposure to weather, chemicals, or water
Resin shifting or distortion from water
Cracking and surface defects of coatings used on flexible substrates
Impact modifier for brittle materials
Impact resistance for coatings, adhesives, composites, and potting and encapsulation materials
Highly adhesive to metal, porcelain, and concrete
Coatings
Adhesives
Composites
Potting and encapsulation materials
Base films/sheets for wearable devices
Additives for stress relaxation (to avoid cracking and warpage)
Impact modifier for brittle materials
jER™ specialty epoxy resins are engineered to provide maximum performance in modern formulations used in the evolving electronics manufacturing space.
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