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jER™ YX7400N is a liquid-type epoxy resin with excellent elasticity, impact resistance, rebound resilience, and post-cure flexibility, making it an ideal choice for consumer appliances and electronics, electrical devices, assemblies, parts and components, and various coatings.
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jER™ YX7400N is a liquid-type epoxy resin adduct formed from reacting epichlorohydrin and an aliphatic polyol. It contributes excellent elasticity and rebound resilience, which help improve impact resistance when used in applications such as coatings, adhesives, composites, and potting and encapsulation materials. It can maintain this flexibility after curing, allowing for use in consumer appliances and electronics, electrical devices, assemblies, parts and components, electrical adhesives, and impact modifiers.
Epoxy equivalent weight (WPE): 400–500
Viscosity @ 25°C: 100–250 mPa·s
Appearance: Colorless yellow liquid
Density @ 25°C: 1.0 g/cm3
Cured State Properties:
Tg: -57−C
Td5: 283°C
Tensile modulus: 0.9 MPa
Tensile strength: 0.2 MPa
Tensile elongation: 20 MPa
Resilience @ 23°C: 84%
Cured State Properties Formulation:
jER™ YX7400N: 100 phr
Bisphenol A novolac: Equivalent to epoxy group of YX7400N
Triphenylphosphine: 1 phr
Curing Condition: 80°C/3 hr + 140°C/3 hr
Elastic properties
Increases the impact resistance of coatings, adhesives, composites, and potting and encapsulation materials
Rubbery elastic
Keeps flexibility even after curing
Rebound resilience
Adduct formed from the reaction of epichlorohydrin and an aliphatic polyol
Excellent elasticity
Impact resistance
Damage to coatings caused by exposure to weather, chemicals, or water
Resin shifting or distortion from water
Cracking and surface defects of coatings used on flexible substrates
Increases the impact resistance of coatings, adhesives, composites, and potting and encapsulation materials
Consumer appliances and electronics
Electrical devices, assemblies, parts, and components
Electronics adhesives
Electrical and electronic packaging and assembly
Specialty and conformal coatings
Potting compounds
Printed circuit boards (PCBs)
Semiconductor manufacturing
Additives for stress relaxation (to avoid cracking, warpage)
Impact modifier for brittle materials
Base films/sheets for wearable devices
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