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AI workloads, edge computing, and high-density GPU infrastructure are increasing thermal loads beyond what traditional air-cooling systems can handle. Higher rack densities demand cooling solutions that enhance uptime, scalability, serviceability, and reliability.
DOWFROST™ LC is an inhibited propylene glycol-based heat transfer fluid designed specifically for liquid cooling systems where thermal performance, corrosion protection, freeze protection, and system compatibility are critical. Its primary applications in data center environments are Direct-to-Chip cooling and support for in-rack closed-loop and in-row close-coupled cooling systems.
Traditional air cooling has supported data centers for many years, but the rise of high-density compute is changing cooling requirements. As more heat is generated at the rack level, operators need cooling systems that can manage thermal loads without increasing facility footprint, maintenance complexity, or energy demand.
Liquid cooling technologies offer targeted heat removal for high-performance computing systems. Options such as Direct-to-Chip cooling provide a strong balance of thermal performance, serviceability, and system compatibility, especially when supported by DOWFROST™ LC.
Direct-to-Chip systems pump coolant through cold plates on CPUs or GPUs, transferring heat into the fluid. The heat then moves to a secondary loop connected to a cooling distribution unit (CDU).
This approach is especially relevant for high-density racks, allowing heat to be removed close to the source while supporting modular scalability, reduced floor-space requirements, and easier maintenance.
The heat transfer fluid in a liquid cooling loop is central to system reliability, corrosion resistance, freeze protection, serviceability, and long-term performance.
Using the right heat transfer fluid is essential for mission-critical cooling systems. DOWFROST™ LC 25 is formulated for Direct-to-Chip, in-rack, and close-coupled cooling systems, ensuring reliable heat transfer while protecting against corrosion, fluid breakdown, biofouling, scaling, and freeze-related issues.
| Benefit | Value for Data Center Operations |
|---|---|
| Heat Transfer Support | Supports heat removal in high-density Direct-to-Chip and rack-level cooling systems |
| Corrosion Protection | Advanced inhibitor package helps protect yellow metals such as copper and brass used in cold plates and heat exchangers |
| Freeze and Burst Protection | Supports systems exposed to rooftop, outdoor, or cold ambient conditions |
| Biostability | Helps prevent fluid breakdown, biofouling, and scaling over time. |
| Leak Detection Support | Dyed fluid helps improve visibility for leak detection and system monitoring. |
| Long Fluid Lufe | Supports stable operation across a wide temperature range with minimal degradation |
| System Compatibility | Engineered for Direct-to-Chip, in-rack closed-loop, and in row close coupled cooling systems |
| Product | Propylene Glycol Volume | Freeze Point | Maximum Recommended Temperature | Volume Expansion |
|---|---|---|---|---|
| DOWFROST™ LC 25% | 25% | -14°F / -10°C | 195°F | 5.2% |
| DOWFROST™ LC 55% | 55% | -40°F / -40°C | 195°F | 7.7% |
These two DOWFROST™ LC solutions enable system designers and operators to select the best fit based on operating environment, freeze-protection requirements, and cooling system design.
DOWFROST™ LC is ideal for data center liquid-cooling applications that require a propylene glycol-based, corrosion-inhibited heat-transfer fluid specifically designed for these demanding environments.
Supported system applications include:
Direct-to-Chip cooling
In-rack closed-loop cooling
In-row close-coupled cooling
Cooling systems using CDUs
High-density server rack cooling
AI and GPU data center cooling
Retrofit and new-build liquid cooling systems
DOWFROST™ LC is not suitable for immersion cooling. Its optimal use is in Direct-to-Chip and rack-level closed-loop cooling—the core systems it is engineered to support.
The DOWFROST™ product family contains propylene glycol-based heat transfer fluids for closed-loop and secondary cooling. DOWFROST™ and DOWFROST™ HD provide freeze and burst protection across diverse markets.
For data center cooling, focus on DOWFROST™ LC, which is specifically designed for Direct-to-Chip and rack-level cooling systems, setting it apart from other products in the DOWFROST™ range.
Data centers require cooling systems that can support high-density computing without compromising uptime or long-term system reliability. Direct-to-Chip and rack-level liquid cooling provide a practical route for managing heat at the source, especially in environments driven by demand for AI, GPUs, and edge computing.
DOWFROST™ LC supports these systems with engineered, inhibited, propylene glycol-based heat-transfer performance, providing corrosion protection, freeze and burst protection, biostability, leak-detection support, and long fluid life. It is a purpose-built option for Direct-to-Chip and rack-level cooling systems in new or retrofit data center infrastructures.
Need support selecting a DOWFROST™ LC fluid for your data center cooling system? Contact ChemPoint to request a quote, discuss system requirements, or speak with a specialist about DOWFROST™ LC for Direct-to-Chip and rack-level liquid cooling applications.
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