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PARALOID™ TMS-2670J
Dow PARALOID™ TMS-2670J MBS impact modifier helps overcome the brittle mechanical behavior of epoxy resins and composites for various demanding applications.
Fulfilled By ChemPoint
- Manufacturer: Dow
- Product Line: Dow PARALOID™ Plastic Additives
- Product: PARALOID™ BPM Impact Modifiers
- Industries: Adhesives | Plastics
- Authorized Countries: Canada | United States
Fulfilled By ChemPoint
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Overview
Dow PARALOID™ TMS-2670J is a methacrylate-butylacrylate-styrene (MBS) core-shell acrylic impact modifier. PARALOID™ TMS-2670J impact modifier is supplied in free-flowing powder form to allow for easy dispersion while improving impact efficiency. This methacrylate-butylacrylate-styrene grade offers a narrow, submicron particle size with a cross-linked butadiene-styrene core and acrylic shell for optimal interaction with epoxy resins.
Dow PARALOID™ TMS-2670J impact modifier has a slight effect on the viscosity of epoxy resin polymers, allowing for improved processability and impact strength. This Dow grade provides excellent retention of the glass transition temperature, improved strength at low and room temperatures, increased elongation at break, fatigue resistance, and enhanced adhesion to metal substrates. PARALOID™ TMS-2670J improves epoxy resin toughness threefold while contributing to good fatigue resistance compared to base epoxy resin. At the same time, it reduces material waste due to fewer breakages during the formulation.
Specifications
Form: Free-flowing powder
Color: White
Odor: Sweet
Relative density (water = 1): 1.0–1.2
Water solubility: Insoluble
Volatiles (% max): <1%
Primary Chemistry: Acrylic polymer(s)
Features & Benefits
- Butadiene-based core-shell structure
- Easily dispersible
- Highly efficient
- Minimal effect on viscosity
- Enhanced adhesion properties
- Retention of excellent thermal properties
- Retention of the glass-transition temperature
Problems Solved
Difficulties with adhesion and electrical properties Lack of temperature and chemical resistance Complications with dispersibility in epoxy formulations Lack of impact strength due to epoxy's brittle nature
Applications
Structural adhesives in energy windmills, automotive, aerospace, sporting goods, and electronics Resins for circuit board laminates, underfill, and encapsulants Liquid resins for composites in wind energy and structural components Protective coatings for automotive, marine, transportation, and building and construction
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