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jER™ 1750 is a low-viscosity, liquid-type epoxy resin appropriate for use in sealants, casting agents, and adhesives in electrical and electronic applications and fiber-reinforced plastics. It is also used in liquid underfill and adhesives for semiconductor manufacturing.
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jER™ 1750 is a high-purity, low-viscosity bisphenol F-type liquid epoxy resin that displays excellent electrical insulation and resistance to heat, water, and chemicals. It functions as a binder, coupling agent, and adhesion promoter and should be used in applications such as sealants, casting agents, and adhesives in electrical and electronic applications and fiber-reinforced plastics and for liquid underfill and adhesives for semiconductor manufacturing.
Epoxy equivalent weight (WPE): 157 g/eq
Viscosity @ 25°C: 13 P
Total Cl: 800 ppm
Appearance: Pale yellow transparency
Density @ 25°C: 1.187 g/cm3
CAS: 9003-36-5
Very low viscosity
Bisphenol F-type liquid epoxy resin
High purity
Chemical, heat, and water resistance
Electrical insulation
Damage to coatings caused by exposure to weather, chemicals, or water
Resin shifting or distortion from water
Cracking and surface defects of coatings used on flexible substrates
Sealants
Casting agents
Adhesives in electrical and electronic applications
Fiber-reinforced plastic adhesives
Liquid underfill and adhesives for semiconductor manufacturing
Suitable for electronic applications where low viscosity is needed
Liquid underfill/adhesive for semiconductor package
Electrical and electronic (sealants, casting agents, adhesives)
Reinforced plastics
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