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- Manufacturer: Mitsubishi Chemical Group
- Product Line: jER™ Epoxy Resins
- Product: jER™ Thermosetting Epoxy Resins
- Industries: Adhesives | Coatings | Maintenance, Repair, Overhaul
- Authorized Countries: United States
jER™ 1750
jER™ 1750 is a low-viscosity, liquid-type epoxy resin appropriate for use in sealants, casting agents, and adhesives in electrical and electronic applications and fiber-reinforced plastics. It is also used in liquid underfill and adhesives for semiconductor manufacturing.
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Specifications
Epoxy equivalent weight (WPE): 157 g/eq
Viscosity @ 25°C: 13 P
Total Cl: 800 ppm
Appearance: Pale yellow transparency
Density @ 25°C: 1.187 g/cm3
CAS: 9003-36-5
- Manufacturer: Mitsubishi Chemical Group
- Product Line: jER™ Epoxy Resins
- Product: jER™ Thermosetting Epoxy Resins
- Industries: Adhesives | Coatings | Maintenance, Repair, Overhaul
- Authorized Countries: United States
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Note: The producer provides fulfillment and controls personal data. ChemPoint mediates to share data with the producer.
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Product Line
Product
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Authorized Countries
United States
Overview
jER™ 1750 is a high-purity, low-viscosity bisphenol F-type liquid epoxy resin that displays excellent electrical insulation and resistance to heat, water, and chemicals. It functions as a binder, coupling agent, and adhesion promoter and should be used in applications such as sealants, casting agents, and adhesives in electrical and electronic applications and fiber-reinforced plastics and for liquid underfill and adhesives for semiconductor manufacturing.
Specifications
Epoxy equivalent weight (WPE): 157 g/eq
Viscosity @ 25°C: 13 P
Total Cl: 800 ppm
Appearance: Pale yellow transparency
Density @ 25°C: 1.187 g/cm3
CAS: 9003-36-5
Features & Benefits
- Very low viscosity
- Bisphenol F-type liquid epoxy resin
- High purity
- Chemical, heat, and water resistance
- Electrical insulation
Problems Solved
Damage to coatings caused by exposure to weather, chemicals, or water
Resin shifting or distortion from water
Cracking and surface defects of coatings used on flexible substrates
Applications
Sealants
Casting agents
Adhesives in electrical and electronic applications
Fiber-reinforced plastic adhesives
Liquid underfill and adhesives for semiconductor manufacturing
Suitable for electronic applications where low viscosity is needed
Liquid underfill/adhesive for semiconductor package
Electrical and electronic (sealants, casting agents, adhesives)
Reinforced plastics
Related Applications
Adhesives
- Architectural
- Ceramics
- Industrial
- Machinery & Appliances
- Packaging
- Paper & Consumables
- Sealants
- Textiles
Related Chemistries
Maintenance, Repair, Overhaul
Related Functions
Related Technologies
Adhesives
jER™ Epoxy Resins Articles
Explore jER™ Specialty Epoxy Resins
jER™ specialty epoxy resins are engineered to provide maximum performance in modern formulations used in the evolving electronics manufacturing space.
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