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jER™ 1750
jER™ 1750 is a low-viscosity, liquid-type epoxy resin appropriate for use in sealants, casting agents, and adhesives in electrical and electronic applications and fiber-reinforced plastics. It is also used in liquid underfill and adhesives for semiconductor manufacturing.
jER™ 1750 is a high-purity, low-viscosity bisphenol F-type liquid epoxy resin that displays excellent electrical insulation and resistance to heat, water, and chemicals. It functions as a binder, coupling agent, and adhesion promoter and should be used in applications such as sealants, casting agents, and adhesives in electrical and electronic applications and fiber-reinforced plastics and for liquid underfill and adhesives for semiconductor manufacturing.
Specifications
Epoxy equivalent weight (WPE): 157 g/eq Viscosity @ 25°C: 13 P Total Cl: 800 ppm Appearance: Pale yellow transparency Density @ 25°C: 1.187 g/cm3 CAS: 9003-36-5
Features & Benefits
Very low viscosity Bisphenol F-type liquid epoxy resin High purity Chemical, heat, and water resistance Electrical insulation
Problems Solved
Damage to coatings caused by exposure to weather, chemicals, or water Resin shifting or distortion from water Cracking and surface defects of coatings used on flexible substrates
Applications
Sealants Casting agents Adhesives in electrical and electronic applications Fiber-reinforced plastic adhesives Liquid underfill and adhesives for semiconductor manufacturing Suitable for electronic applications where low viscosity is needed Liquid underfill/adhesive for semiconductor package Electrical and electronic (sealants, casting agents, adhesives) Reinforced plastics
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Thank you
Thank you for your inquiry and interest in ChemPoint. We will respond to you shortly.
ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
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