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jER YX7105
jER™ YX7105 is a flexible thermosetting epoxy resin with excellent heat, chemical and water resistance that is recommended for use in printed electronics, semiconductor manufacturing, base film and sheets for wearable devices, coatings and adhesives.
- Manufacturer: Mitsubishi Chemical America
- Product Line: jER™ Epoxy resin
- Product: jER™ Thermosetting Epoxy Resin
- Industries: Adhesives | Coatings | Maintenance, Repair, Overhaul
- Authorized Countries: United States
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Overview
jER™ YX7105 is a liquid type epoxy resin formed from the reaction of epichlorohydrin and a aliphaticd and aromatic polyol. It has excellent adhesiveness, flexibility, impact resistance, and stretchability. It is compatible with a variety of substrates including glass, fibers and fabrics, metals, plastics, steel, aluminum, ceramic and concrete and masonry. It contributes excellent insulation, heat, chemical and water resistance as well as impact resistance for these materials when used in semiconductor, printed electronics and wearable devices to avoid bending and warpage.
Specifications
Epoxy equivalent weight (WPE): 440-500 g/eq
SAP-Cl: 0-100 ppm
Appearance: colorless liquid
Viscosity at 50ºC: 65 P
Density at 25ºC: 1.2 kg/m3
Cured State Properties
Tg: 31ºC
Td5: 336ºC
Tensile Modulus: 64 MPa
Tensile Strength: 8.8 MPa
Tensile Elongation: 153 MPa
Cured State Properties Formulation
jER™ YX7105: 100 phr
Bisphenol A Novolac: 25 phr
2-Ethyl-4-methylimidazole: 0.05 phr
Curing condition: 170ºC/1hr + 180ºC/1hr
Features & Benefits
Excellent adhesion
Good toughness
Good mechanical, impact and crack resistance
Excellent elasticity and flexibility
Highly adhesive to metal, porcelain and concrete
Excellent insulation
High heat resistance
High chemical resistance
High water resistance
Reactive epoxy group at end
Liquid aliphatic resin
Problems Solved
Damage to coatings caused by exposure to weather or water
Resin shifting or distortion from water
Cracking and surface defects of coatings used on flexible substrates
Applications
Impact modifier
Coupling Agent
Binder
Adhesion promoter
Compatible with a wide variety of substrates including glass, fibers and fabrics, metal, plastics, steel, aluminum, ceramic, concrete and masonry
Printed electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)
Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)
Base film and sheet for wearable devices
Coatings
Adhesives
Related Applications
Adhesives
- Architectural
- Ceramics
- Industrial
- Machinery & Appliances
- Packaging
- Paper & Consumables
- Sealants
- Textiles
Related Chemistries
Maintenance, Repair, Overhaul
Related Functions
Related Technologies
Adhesives
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