jER™ YX7105

jER™ YX7105 is a flexible thermosetting epoxy resin with excellent heat, chemical, and water resistance. It is recommended for use in printed electronics, semiconductor manufacturing, coatings, adhesives, and base films and sheets for wearable devices.

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Specifications

Epoxy equivalent weight (WPE): 440–500 g/eq
SAP Cl: 0–100 ppm
Appearance: colorless liquid
Viscosity at 50ºC: 65 P
Density at 25ºC: 1.2 kg/m3
Cured State Properties:
Tg: 31°C
Td5: 336°C
Tensile modulus: 64 MPa
Tensile strength: 8.8 MPa
Tensile elongation: 153 MPa
Cured State Properties Formulation:
jER™ YX7105: 100 phr
Bisphenol A novolac: 25 phr
2-Ethyl-4-methylimidazole: 0.05 phr
Curing condition: 170°C/1 hr + 180°C/1 hr

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Manufacturer
Mitsubishi Chemical Group
Product Line
jER™ Epoxy Resins
Product
jER™ Thermosetting Epoxy Resins
Industries
Adhesives Coatings Maintenance, Repair, Overhaul
Authorized Countries
United States
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Specifications

Epoxy equivalent weight (WPE): 440–500 g/eq
SAP Cl: 0–100 ppm
Appearance: colorless liquid
Viscosity at 50ºC: 65 P
Density at 25ºC: 1.2 kg/m3
Cured State Properties:
Tg: 31°C
Td5: 336°C
Tensile modulus: 64 MPa
Tensile strength: 8.8 MPa
Tensile elongation: 153 MPa
Cured State Properties Formulation:
jER™ YX7105: 100 phr
Bisphenol A novolac: 25 phr
2-Ethyl-4-methylimidazole: 0.05 phr
Curing condition: 170°C/1 hr + 180°C/1 hr

Features & Benefits

  • Excellent adhesion
  • Good toughness
  • Good mechanical, impact, and crack resistance
  • Excellent elasticity and flexibility
  • Highly adhesive to metal, porcelain, and concrete
  • Excellent insulation
  • High heat resistance
  • High chemical resistance
  • High water resistance
  • Reactive epoxy group at end
  • Liquid aliphatic resin

Problems Solved

Damage to coatings caused by exposure to weather or water
Resin shifting or distortion from water
Cracking and surface defects of coatings used on flexible substrates

Applications

Impact modifier
Coupling agent
Binder
Adhesion promoter
Compatible with a wide variety of substrates, including glass, fibers, fabrics, metal, plastics, steel, aluminum, ceramic, concrete, and masonry
Printed electronics (resist ink, build-up wire boards, flexible printed wire boards, metal core printed circuit boards)
Semiconductor manufacturing (liquid mold compounds, underfill, sidefill, die bonding, ACF, NCF, ACP, NCP)
Base films and sheets for wearable devices
Coatings
Adhesives

Related Applications
Adhesives Coatings
Related Chemistries
Maintenance, Repair, Overhaul
Related Functions
Adhesives Coatings
Related Technologies
Adhesives

jER™ Epoxy Resins Articles

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Explore jER™ Specialty Epoxy Resins

jER™ specialty epoxy resins are engineered to provide maximum performance in modern formulations used in the evolving electronics manufacturing space.

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