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jER™ YX7105
jER™ YX7105 is a flexible thermosetting epoxy resin with excellent heat, chemical, and water resistance. It is recommended for use in printed electronics, semiconductor manufacturing, coatings, adhesives, and base films and sheets for wearable devices.
- Manufacturer: Mitsubishi Chemical Group
- Product Line: jER™ Epoxy Resins
- Product: jER™ Thermosetting Epoxy Resins
- Industries: Adhesives | Coatings | Maintenance, Repair, Overhaul
- Authorized Countries: United States
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Overview
jER™ YX7105 is a liquid-type epoxy resin formed from reacting epichlorohydrin and an aliphatic and aromatic polyol. It has excellent adhesiveness, flexibility, impact resistance, and stretchability. It is compatible with a variety of substrates, including glass, fibers, fabrics, metals, plastics, steel, aluminum, ceramic, concrete, and masonry. It contributes excellent insulation, heat, chemical, water, and impact resistance to these materials when used in semiconductors, printed electronics, and wearable devices to avoid bending and warpage.
Specifications
Epoxy equivalent weight (WPE): 440–500 g/eq
SAP Cl: 0–100 ppm
Appearance: colorless liquid
Viscosity at 50ºC: 65 P
Density at 25ºC: 1.2 kg/m3
Cured State Properties:
Tg: 31°C
Td5: 336°C
Tensile modulus: 64 MPa
Tensile strength: 8.8 MPa
Tensile elongation: 153 MPa
Cured State Properties Formulation:
jER™ YX7105: 100 phr
Bisphenol A novolac: 25 phr
2-Ethyl-4-methylimidazole: 0.05 phr
Curing condition: 170°C/1 hr + 180°C/1 hr
Features & Benefits
Excellent adhesion
Good toughness
Good mechanical, impact, and crack resistance
Excellent elasticity and flexibility
Highly adhesive to metal, porcelain, and concrete
Excellent insulation
High heat resistance
High chemical resistance
High water resistance
Reactive epoxy group at end
Liquid aliphatic resin
Problems Solved
Damage to coatings caused by exposure to weather or water
Resin shifting or distortion from water
Cracking and surface defects of coatings used on flexible substrates
Applications
Impact modifier
Coupling agent
Binder
Adhesion promoter
Compatible with a wide variety of substrates, including glass, fibers, fabrics, metal, plastics, steel, aluminum, ceramic, concrete, and masonry
Printed electronics (resist ink, build-up wire boards, flexible printed wire boards, metal core printed circuit boards)
Semiconductor manufacturing (liquid mold compounds, underfill, sidefill, die bonding, ACF, NCF, ACP, NCP)
Base films and sheets for wearable devices
Coatings
Adhesives
Related Applications
Adhesives
- Architectural
- Ceramics
- Industrial
- Machinery & Appliances
- Packaging
- Paper & Consumables
- Sealants
- Textiles
Related Chemistries
Maintenance, Repair, Overhaul
Related Functions
Related Technologies
Adhesives
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