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SP-553 is a thermoplastic phenolic resin that is excellent for use as a tackifier in solvent-borne and hot melt adhesives.
SP-553 is a terpene-phenolic resin that is oil soluble and specifically designed for use in solvent-based adhesive formulations. It is primarily used to increase tackiness and retention of polychloroprene and SBR adhesives.
In polychloroprene adhesives and cement, SP-553 resin is used as a tackifier to improve the adhesive film's cohesive strength. SP-553 also can be used in the presence of magnesium oxides as it doesn't react with the compounds that typically reduce the tackiness of adhesives.
Physical form: Solid flakes
Specific gravity: 1.00
Softening point (Ball and Ring): 110-120°C
Color, Gardner, 50% in Toluene: 0-10
Primary Chemistry: Terpene Phenolic Resin
Oil soluble
Thermoplastic resin
Excellent tackifier for adhesives
Doesn't react with magnesium oxides
Reduction of tackiness in adhesive films
Compatibility issue of phenolic resins with solvent based adhesives
Solvent borne adhesives
Hot-melt adhesives
Polychloroprene and SBR adhesives
Pressure sensitive mastics
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