BONDERITE® S-FN 213 (previously known as DAG 213) is a dispersion of finely divided graphite pigment in an epoxy resin solution. Once cured, the coating provides excellent adhesion and wear protection to electronic circuit boards, bushings, plastics, and ceramic substrates. Its high degree of flexibility makes the coating well suited for malleable parts, such as rubber and plastic, while the graphite particles provide electrical resistance properties ideally suited for sensitive electronic applications. BONDERITE® S-FN 213 can also function as a dry film lubricant for clean, dry, long-wearing, and maintenance-free lubrication. The product reduces the overall friction of mating metal surfaces and the risk of partial or complete seizure.