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BONDERITE® S-FN 213 is a dispersion of fine graphite in epoxy resin for lubrication and protection of electronic circuit boards, bushings, plastics, and ceramics.
BONDERITE® S-FN 213 (previously known as DAG 213) is a dispersion of finely divided graphite pigment in an epoxy resin solution. Once cured, the coating provides excellent adhesion and wear protection to electronic circuit boards, bushings, plastics, and ceramic substrates. Its high degree of flexibility makes the coating well suited for malleable parts, such as rubber and plastic, while the graphite particles provide electrical resistance properties ideally suited for sensitive electronic applications. BONDERITE® S-FN 213 can also function as a dry film lubricant for clean, dry, long-wearing, and maintenance-free lubrication. The product reduces the overall friction of mating metal surfaces and the risk of partial or complete seizure.
Typical properties of wet product:
Color: Black
Pigment: Graphite
Binder: Thermoset resins
Carrier: Acheson SB-2
Diluent: Acheson SB-2
Consistency: Liquid
Viscosity, mPa·s: 2800
Density, lb/gal: 8.2
Solids content by weight, %: 28
Flash point, °F: 45
VOC, lb/gal: 5.9
Theoretical coverage: 8.4 m2/L at 25 μm (338 ft2/gal at 1 mil)
Typical properties, as cured:
Color: Black
Sheet resistance: 96 hours over zinc phosphated surface, 25-micron film thickness
Electronic hardware lacking an electrically resistant protective coating is more susceptible to electrical shorts and malfunctions, corrosion and degradation, and contamination from dust, moisture, or humidity, affecting the performance and potentially damaging components. Metal mating parts are also prone to seizing or galling without proper lubrication.
Circuit boards Bushings Electrical fittings and connectors Plastic parts Ceramic parts Battery covers Threads and fasteners
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