Skip to main content

DOWFROST™ LC 25 – Data Center Cooling

Solve Cooling Challenges for Next-Generation Data Centers

 

As AI workloads, edge computing, and high-density GPUs like the NVIDIA H100 become standard, data centers are facing an increasingly urgent challenge: how do you keep temperatures under control without sacrificing performance, uptime, or scalability?

Cooling isn’t a one-size-fits-all solution anymore. From traditional air systems to immersion cooling and advanced direct-to-chip liquid loops, each approach comes with real trade-offs—cost, complexity, serviceability, and risk.

If you’re trying to determine which cooling method is best for your environment—and which heat transfer fluid you can trust to support it—this guide breaks down the pros and cons of each major system and shows why DOWFROST™ LC stands out in direct-to-chip designs.

Why Traditional Air Cooling Is No Longer Enough

Air-based systems using CRAC/CRAH units have long served data centers well. But today’s infrastructure demands more:

  1. Excessive Power Usage: Cooling accounts for up to 40% of facility energy consumption.
  2. Limited Thermal Capacity: Air systems struggle above 50–80kW rack loads.
  3. High Maintenance Costs: Frequent filter changes and fan replacements add cost and complexity.
  4. Scalability Challenges: Upgrading air systems to meet the demands of GPUs like Nvidia’s H100 often requires costly structural changes.
  5. Space Constraints: Larger ducts and fans reduce available rack space and layout flexibility. Not to mention these fans can be extremely loud.

As compute density increases, air cooling alone becomes impractical. Requiring many operators to seek more advanced solutions to meet these new demands.

Comparing Liquid Cooling Technologies

 
Cooling Method Summary Key Drawbacks
Immersion Cooling Entire server hardware submerged in dielectric fluid—ideal for extreme‑density workloads. Complex maintenance, higher capital investment, fluid containment challenges, limited hardware compatibility.
Water‑Based Cooling Deionized water circulates through cold plates; excellent thermal conductivity. Conductive if purity lapses, no freeze protection, higher corrosion risk, limited long‑term stability.
Direct‑to‑Chip (DTC) Propylene‑glycol coolant flows through cold plates attached to CPUs/GPUs. Requires a high‑quality, corrosion‑inhibited fluid—ideal use case for DOWFROST™ LC.

Among these, Direct-to-Chip cooling provides the best balance of performance, serviceability, and system compatibility—especially when supported by the right heat transfer fluid.

Why Direct-to-Chip Cooling + DOWFROST™ LC Is the Right Fit

Direct-to-Chip (DTC) systems circulate coolant through cold plates in contact with CPUs or GPUs, transporting heat to a secondary loop connected to a CDU (cooling distribution unit). These systems offer:

  • High Thermal Efficiency – Ideal for racks with 50–100kW+ power densities
  • Reduced Floor Space Requirements – More compute per square foot
  • Modular Scalability – Add capacity without overhauling infrastructure
  • Lower Risk vs. Immersion – No hardware submersion, easier maintenance
  • Safer Than Water – Avoids electrical risks and corrosion associated with deionized water systems

DOWFROST™ LC 25 is engineered specifically for use in these DTC and in-rack/close-coupled cooling systems.

Why DOWFROST™ LC Is the Premier Fluid for DTC Systems

Generic glycols, DIY blends, and water-based systems introduce risk into mission-critical environments. DOWFROST™ LC eliminates those risks with performance-proven advantages:

  • USP-Grade Dow Puragard™ Propylene Glycol – Manufactured from virgin raw materials to prevent foaming, foul odors, and premature degradation.
  • Advanced Corrosion Inhibitor Package – Protects yellow metals like copper and brass commonly used in cold plates and exchangers.
  • Freeze and Burst Protection – Critical for rooftop or northern installations with ambient exposure.
  • Biostability and Corrosion Control – Prevents fluid breakdown, biofouling, and scaling over time.
  • Dyed for Easy Leak Detection – Enhances serviceability and system monitoring.
  • Low Maintenance, Long Life – Stable across a wide temperature range with minimal degradation.

System Compatibility

DOWFROST™ LC is approved and widely used in:

  • Direct-to-Chip (DTC) Cooling
  • In-Rack (Closed Loop) Cooling
  • In-Row (Close-Coupled) Cooling

These systems are commonly supported by localized or external CDUs that circulate fluid to and from each rack with high thermal precision.

Performance Specifications

  DOWFROST™ LC 25% DOWFROST™ LC 55%
Propylene Glycol (Vol %) 25 55
Freeze Point -14°F (-10°C) -40°F (-40°C)
Maximum Recommended Temperature 195°F
Volume Expansion (-40°C to 90°C) 5.2% 7.7%

Conclusion: Engineered for the Demands of Modern Data Centers

Immersion and water-based cooling may serve niche roles. However, for scalable, maintainable, and efficient rack-level cooling, Direct-to-Chip with DOWFROST™ LC offers unmatched performance and protection.

Contact ChemPoint via our website or by phone for support with data center cooling. Whether for retrofitting, new builds, or enhancing current systems, we provide solutions tailored to your needs. Benefit from our expertise in advanced cooling technologies to optimize performance and sustainability.

Have Us Call You

Phone+31.43.711.01.00

Hi, let us know if you have any questions as you visit our website.

ChemPoint reps are here to assist you