Select Your Region
As AI workloads, edge computing, and high-density GPUs like the NVIDIA H100 become standard, data centers are facing an increasingly urgent challenge: how do you keep temperatures under control without sacrificing performance, uptime, or scalability?
Cooling isn’t a one-size-fits-all solution anymore. From traditional air systems to immersion cooling and advanced direct-to-chip liquid loops, each approach comes with real trade-offs—cost, complexity, serviceability, and risk.
If you’re trying to determine which cooling method is best for your environment—and which heat transfer fluid you can trust to support it—this guide breaks down the pros and cons of each major system and shows why DOWFROST™ LC stands out in direct-to-chip designs.
Air-based systems using CRAC/CRAH units have long served data centers well. But today’s infrastructure demands more:
As compute density increases, air cooling alone becomes impractical. Requiring many operators to seek more advanced solutions to meet these new demands.
Cooling Method | Summary | Key Drawbacks |
Immersion Cooling | Entire server hardware submerged in dielectric fluid—ideal for extreme‑density workloads. | Complex maintenance, higher capital investment, fluid containment challenges, limited hardware compatibility. |
Water‑Based Cooling | Deionized water circulates through cold plates; excellent thermal conductivity. | Conductive if purity lapses, no freeze protection, higher corrosion risk, limited long‑term stability. |
Direct‑to‑Chip (DTC) | Propylene‑glycol coolant flows through cold plates attached to CPUs/GPUs. | Requires a high‑quality, corrosion‑inhibited fluid—ideal use case for DOWFROST™ LC. |
Among these, Direct-to-Chip cooling provides the best balance of performance, serviceability, and system compatibility—especially when supported by the right heat transfer fluid.
Direct-to-Chip (DTC) systems circulate coolant through cold plates in contact with CPUs or GPUs, transporting heat to a secondary loop connected to a CDU (cooling distribution unit). These systems offer:
DOWFROST™ LC 25 is engineered specifically for use in these DTC and in-rack/close-coupled cooling systems.
Generic glycols, DIY blends, and water-based systems introduce risk into mission-critical environments. DOWFROST™ LC eliminates those risks with performance-proven advantages:
DOWFROST™ LC is approved and widely used in:
These systems are commonly supported by localized or external CDUs that circulate fluid to and from each rack with high thermal precision.
DOWFROST™ LC 25% | DOWFROST™ LC 55% | |
Propylene Glycol (Vol %) | 25 | 55 |
Freeze Point | -14°F (-10°C) | -40°F (-40°C) |
Maximum Recommended Temperature | 195°F | |
Volume Expansion (-40°C to 90°C) | 5.2% | 7.7% |
Immersion and water-based cooling may serve niche roles. However, for scalable, maintainable, and efficient rack-level cooling, Direct-to-Chip with DOWFROST™ LC offers unmatched performance and protection.
Contact ChemPoint via our website or by phone for support with data center cooling. Whether for retrofitting, new builds, or enhancing current systems, we provide solutions tailored to your needs. Benefit from our expertise in advanced cooling technologies to optimize performance and sustainability.
Thank you for your inquiry and interest in ChemPoint.
We will respond to you shortly.
ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
We’ve detected that you are located in a different region than the region selected on the website. Would you like to change your region?
Current Region: English - Canada