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Thermogrip® 0720 is an extremely versatile adhesive. Applied at 280°F to 400°F, it bonds to most porous and many nonporous substrates.
Features & Benefits
Offers excellent bonds to a wide variety of substrates at lower temperatures than conventional hot melts
Problems Solved
Substrate Adhesive Fall Off Inconsistent or Inferior Bond Formation
Applications
Corrugated to styrene and EPS for specialty packaging. Bonds to some PVC, nylon, and other plastics. Bonds to many open and closed-cell foams @ < 300°F Product assembly Insulation installation