SP-1055 is a heat-reactive phenolic resin that is based on brominated octyl phenol-formaldehyde. It is excellent for use in butyl rubbers and unsaturated elastomers.
SP-1055 is a heat-reactive brominated phenolic resin that contains methylol groups. It allows a faster cure of butyl rubbers or other unsaturated elastomers without the requirement of halogen donors.
Brominated resins are especially useful for applications when the rubber may be exposed to heat or repeated use. SP-1055 prevents quick deterioration by curing or crosslinking.
SP-1055 is also used to crosslink elastomers in the manufacturing of pressure-sensitive adhesives. It provides improved cohesive strength while imparting little color to the finished adhesive, allowing high clarity film formation.
Physical form: Solid flakes
Specific gravity: 1.05
Softening point (Ball and Ring): 85-95°C
Methylol content: 10.0-14.0%
Bromine content: 3.6-4.0%
Primary Chemistry: Brominated octylphenol formaldehyde resin
High temprature stability
Superior processing properties
Exceptional scorch safety for a wide processing range
Supplied in flaked form for easy handling
Slower cure than SP-1056, due to a lower bromine content
Scorch safety issues with phenolic or other resins
Low cohesive strength and color changes while curing rubber adhesives
Butyl rubbers and unsaturated elastomers
Rubber and pressure sensitive adhesives
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