LOCTITE® EA 9464 is a thixotropic adhesive paste with versatile compatibility, bonding to various surfaces, including metals, phenolic plastics, hard boards and forestry products, polyester, rubbers, ceramics, masonry, and more.
Resin properties:
Appearance: White opaque paste
Specific gravity @ 25 °C: 1.35
Viscosity, DIN 54453, mPa·s (cP), shear rate 10 s¯¹: 138,000
Viscosity, DIN 54453, mPa·s (cP), shear rate 100¯¹: 40,000
Thixotropic index: 3.5
Hardener properties:
Appearance: Black opaque paste
Specific gravity @ 25°C: 1.3
Viscosity, DIN 54453, mPa·s (cP), shear rate 10s¯¹: 55,000
Viscosity, DIN 54453, mPa·s (cP), shear rate 100S¯¹: 35,000
Thixotropic index: 1.6
Mixed properties:
Appearance: Gray opaque paste
Pot Life @ 22°C, minutes: 15 to 20
Fixture Time, mixed, @ 22°C, minutes: 180
Primary Chemistry:
Epoxy
LOCTITE® EA 9464 is a fast-curing version of LOCTITE® EA 9461epoxy adhesive with excellent additional physical and functional benefits. Formulated as a two component product, it consists of an epoxy resin and hardener that should be mixed in a 1:1 ratio to form a thixotropic paste that is easy to apply and highly recommended for gap-filling applications. It imparts excellent peel and shear strength as well as non-slag slump resistance. It develops handling strength in 3 to 4 hours at room temperature and has a reduced pot life and fixture time when compared to LOCTITE® EA 9461.
Resin properties:
Appearance: White opaque paste
Specific gravity @ 25 °C: 1.35
Viscosity, DIN 54453, mPa·s (cP), shear rate 10 s¯¹: 138,000
Viscosity, DIN 54453, mPa·s (cP), shear rate 100¯¹: 40,000
Thixotropic index: 3.5
Hardener properties:
Appearance: Black opaque paste
Specific gravity @ 25°C: 1.3
Viscosity, DIN 54453, mPa·s (cP), shear rate 10s¯¹: 55,000
Viscosity, DIN 54453, mPa·s (cP), shear rate 100S¯¹: 35,000
Thixotropic index: 1.6
Mixed properties:
Appearance: Gray opaque paste
Pot Life @ 22°C, minutes: 15 to 20
Fixture Time, mixed, @ 22°C, minutes: 180
Primary Chemistry:
Epoxy
Poor adherence of adhesive to dissimilar surfaces
Drip or sag of adhesive prior to cure
Bonding dissimilar substrates
Gap filling
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