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LOCTITE® EA 9489
LOCTITE® EA 9489 is a versatile two-component adhesive epoxy available with an epoxy resin and polyamide hardener with a 1:1 mix ratio prior to use. Upon mixing, it forms a medium viscosity paste with a grey opaque color and long pot life of 60 to 110 min.
LOCTITE® EA 9489 is a medium-viscosity, two-part epoxy adhesive that is recommended as a multi-substrate structural bonder for strain gauges, fiberglass seams, printed circuit boards, stainless steal inserts, rubber hoses, and more. It bonds to a wide variety of substrates, including wood, plastics, metals, rubbers, glass, ceramics, and masonry materials, offering an extended working life of 60 to 120 minutes, allowing for adequate time for adjustments to parts during assembly. It is capable of filling 3.0 mm gaps, forming a flexible bond line that provides excellent electrical insulation and is resistant to chemicals, solvents, shock, and impacts.
Specifications
Resin properties: Chemistry: Epoxy Appearance: Light beige liquid Specific gravity @ 25°C: 1.32 to 1.38 Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP), Spindle 7, speed 5 rpm: 35,000 to 135,000 Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP), Spindle 7, speed 10 rpm: 60,000 to 175,000 Hardener properties: Chemistry: Polyamide Appearance: Gray, opaque liquid Specific gravity @ 25 °C: 1.06 to 1.12 Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP), Spindle 6, speed 10 rpm: 20,000 to 45,000 Mixed properties: Specific gravity @ 25 °C: 1.2 Pot life @ 25°C, minutes: 60 to 110 Fixture time, @ 22°C, hours: 5 Primary Chemistry: Epoxy
Features & Benefits
Two-part epoxy adhesive
1:1 mix ratio
Room temperature cure after mixing
Medium viscosity
Extended working life
3.0 mm gap fill maximum
Excellent electrical insulation
Shock and impact resistance
Resistant to chemicals and solvents
High flexibility
Problems Solved
Poor adherence of adhesive to difficult substrates and rough or poorly fitting surfaces, like metals, glass, ceramics, plastics, rubber, wood, and masonry materials
Poor aesthetic appearance of bonding line after cure
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