LOCTITE® EA 9497 is a premium, two-component adhesive product recommended for use as a high-performance structural bonder in high-temperature applications up to 200°C. It can be mixed in a 2:1 ratio to form a grey medium viscosity liquid and cured at room temperature or using heat or induction curing.
LOCTITE® EA 9497 is a medium-viscosity epoxy adhesive available in a two-part formulation meant to be mixed in a 2:1 ratio. It provides excellent gap-filling properties, filling gaps up to 3.0 mm in width, and cures at room temperature or using heat or induction cures. Upon curing, it provides excellent resistance properties, withstanding thermal conductivity, high compression, high impact, humidity, and high temperatures up to 200°C. It is recommended for the bonding of metal sheets, electrical components, surface permanent magnets (SPM), and interior permanent magnets (IPM). LOCTITE® EA 9497 provides optimal fixture in 8 hours and a shear strength of 20 N/mm².
Resin properties:
Appearance: White liquid
Specific gravity @ 25°C: 2.05 to 2.13
Casson viscosity, Cone & Plate Rheometer, Pa•s: 5 to 16
Hardener properties:
Appearance: Gray liquid
Specific gravity @ 25°C: 2.02 to 2.1
Casson viscosity, Cone & Plate Rheometer, Pa•s: 8 to 24
Mixed properties:
Pot life @ 25°C, minutes: 165 to 255
Fixture time, ISO 4587, @ 22°C, hours: 8
Coefficient of thermal conductivity, ISO 8302, W/(m-K): 1.4
Coefficient of thermal expansion ISO 11359-2, K¯¹: 50×10¯⁶
Linear shrinkage, ISO 1675, %: 0.73
Tensile strength, ISO 37 N/mm² (psi): 52.6 (7,640)
Tensile modulus, ISO 37 N/mm² (psi): 2,420 (351,000)
Compressive strength N/mm² (psi): 112.5 (16,300)
Elongation, ISO 37,%: 2.9
Shore hardness, ISO 868, durometer D: 83
Glass transition temperature, ISO 11359-2, °C: 67
Primary Chemistry: Epoxy
Two-component epoxy adhesive
2:1 mix ratio
Room temperature, heat, or induction cure
Medium viscosity
High-temperature resistance
High thermal conductivity
High compression strength
Fixture time of 8 hours
Large gap fill (up to 3mm)
High shear strength of 20 N/mm²
Excellent heat dissipation
Poor adherence of adhesive to difficult substrates and rough or poorly fitting surfaces
Poor aesthetic appearance of bonding line after cure
Poor electrical resistance of potting material
Bonds sheet metal and electrical components
Surface Permanent Magnet (SPM) and Interior Permanent Magnet (IPM) bonding
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