LOCTITE® EA M-121HP is an innovative medium-viscosity epoxy adhesive designed for bonding applications, particularly in the assembly of disposable medical devices. It is available as a two-part formulation that forms an off-white to beige paste upon mixing in a 2:1 ratio by volume. It forms a tough durable bond line when cured at room temperature.
LOCTITE® EA M-121HP is a high-performance adhesive recommended for applications requiring strong and durable bonds, such as the assembly of disposable medical devices. It provides excellent adhesion to various substrates, including plastics, ceramics, and metals, such as aluminum and steel. It is available in a 50mL dual cartridge container to keep the base resin and hardener separate before use. It mixes after dispensing to form a medium viscosity, off-white to beige paste that cures at room temperature. LOCTITE® EA M-121HP provides excellent peel and impact resistance, in addition to durability against thermal shock, chemicals, and solvents.
Resin:
Specific gravity @ 25°C: 1.1
Viscosity, Brookfield - RVT, 25°C, mPa·s (cP), Spindle 7, speed 50 rpm: 41,000 to 61,000
Hardener:
Specific gravity @ 25°C: 1.0
Viscosity, Brookfield - RVT, 25°C, mPa·s (cP), Spindle 5, speed 50 rpm: 2,000 to 4,000
Mixed properties:
Specific gravity @ 25°C: 1.07
Gel time @ 100°C, seconds: 120 to 240
Working life, minutes: 120
Tack free time, (low humidity) minutes: 140
Glass transition temperature, ASTM E 228, °C: 90
Elongation , ISO 527-5, %: 10
Tensile Strength, ISO 527-2 N/mm2 (psi): 5,910 (5,910)
Shore hardness, ISO 868, Durometer D: 76 to 90
Dielectric breakdown strength, IEC 60243-1, kV/mm: 25.6
Primary Chemistry: Epoxy
Two-part adhesive
Medium viscosity
2:1 mix ratio
Room temperature cure
High impact resistance
Non-sag
Resistance to peel and impact forces
Bonds to plastics, ceramics, and metals, like steel and aluminum
Resistant to chemicals and solvents
Thermal shock resistance
Poor adherence of adhesive to difficult substrates and rough or poorly fitting surfaces
Poor aesthetic appearance of bonding line after cure
Bonding disposable medical devices
Low stress applications
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