LOCTITE® SI 5616 is a two-part carbon-free adhesive paste from Henkel with a silicone technology base and a thixotropic viscosity. It can be mixed in a 2:1 ratio by volume and applied to high-temperature bonding and sealing applications.
Part A:
Appearance: White paste
Density @ 25°C: 1.1 to 1.4
Viscosity, Cone & Plate, mPa·s (cP): 20,000 to 110,000
Part B:
Appearance: White paste
Density @ 25°C: 1.55 to 1.75
Viscosity, Cone & Plate, mPa·s (cP): 10,000 to 70,000
Mixed:
Appearance: White paste
Pot life, minutes: 5
Skin over time, minutes: 21
Fixture time, minutes: 13
Coefficient of thermal conductivity, W/(m·K): 0.71
Coefficient of thermal expansion, K¯¹: 280×10¯⁶
Elongation, at break, ISO 527-3, %: 200
Shore Hardness, Durometer A: 30
LOCTITE® SI 5616 is a special sealing and bonding formulation designed for use on stovetop assemblies, weld/rivet reductions, electronic devices, and other high-temperature applications. It exhibits excellent heat tolerance up to 292°F and excellent bonding compatibility with metals, glass, and Ceran® surfaces. Formulated as a two-part composition, LOCTITE® SI 5616 carbon-free adhesive should be mixed in a 2:1 ratio by volume to provide a fast-curing white paste with a thixotropic viscosity that provides fixture in 13 minutes. LOCTITE® SI 5616 exhibits a secondary cure over 7 days when exposed to atmospheric humidity.
Part A:
Appearance: White paste
Density @ 25°C: 1.1 to 1.4
Viscosity, Cone & Plate, mPa·s (cP): 20,000 to 110,000
Part B:
Appearance: White paste
Density @ 25°C: 1.55 to 1.75
Viscosity, Cone & Plate, mPa·s (cP): 10,000 to 70,000
Mixed:
Appearance: White paste
Pot life, minutes: 5
Skin over time, minutes: 21
Fixture time, minutes: 13
Coefficient of thermal conductivity, W/(m·K): 0.71
Coefficient of thermal expansion, K¯¹: 280×10¯⁶
Elongation, at break, ISO 527-3, %: 200
Shore Hardness, Durometer A: 30
Degradation of seals at high temperatures
Poor flexibility of adhesive sealants in industrial applications
Glass stovetop assemblies
Weld and rivet reduction
High temperature applications
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