BONDERITE® C-SO 263 Wipes is a premoistened cleaning wipe recommended for the removal of adhesives, sealers, sanding dust, and general soils from bare metal sheet molding compounds. BONDERITE® C-SO 263 Wipes contains no hazardous air pollutants (HAPs) or superfund amendments and reauthorization act (SARA) reportables.
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BONDERITE® C-SO 263 Wipes are industrial cleaning wipes pre-saturated with a non-chlorine solvent-based solution recommended for the cleaning and degreasing of metal solutions prior to bonding applications. Upon use, it quickly dissolves or loosens excess adhesives, sealers, sanding dust, and general soils from bare metals and painted and plastic surfaces, absorbing any residue into the wipe.
BONDERITE® C-SO 263 Wipes should be applied using nitrile gloves.
Physical form: Wipes
Temperature range: Ambient
VOCs: None
Solvent-based pre-saturated cleaning wipes
Removes excess sealers, adhesives, sanding dust, and general soils from bare metals and sheet molding compounds
Dries in place
Non-chlorine
No hazardous air pollutants (HAPs)
Tough to remove sealers, adhesives, sanding dust, and general soils
Poor metal parts surface preparation
Clean and prepare bare metals and sheet molding compounds or E-coated surfaces
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Thank you for your inquiry and interest in ChemPoint.
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ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
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