BONDERITE^® S-FN 109B (previously known as DAG 109B) is a graphite dispersion that dries quickly to form a flexible conductive coating, making it an ideal choice for a range of industrial applications. It is formulated with high-purity, fine-grain graphite alongside a highly flexible thermoplastic resin that provides high adhesion to most metal alloys and plastics. This combination not only ensures exceptional adhesion but also enhances the electrical performance by preventing cracks from forming in the cured film. The high-purity concentration of graphite results in a highly conductive coating, which is capable of finely controlling electrical properties on the substrate surface, thus making it suitable for electronic devices and components. To achieve optimal results, BONDERITE^® S-FN 109B should be applied using a spray system or traditional printing techniques, methods that facilitate a controlled and well-distributed film thickness across the substrate. Ensuring the proper thickness and consistency is crucial, as it enhances the coating's performance and longevity, ultimately leading to more efficient electrical conductivity and a more robust protection of the underlying material.