Lutron® Q 75
Lutron® Q 75 is used in the electronics and electroplating industries as a complexing agent in electroless copper plating baths at a concentration of 10 – 30 g/l. It is mainly used in the production of printed circuit boards and for plating plastics
- Manufacturer: BASF
- Product Line: BASF Metal Surface Treatment
- Product: Lutron® Functional Fluids
- Industries: Metal Processing & Fabrication
- Region: North America
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Documents:
Product Overview
The complexing power of Lutron® Q 75 for copper is similar to that of EDTA in the alkaline pH range (pH 12). It can be applied alone or in combination with neutralized Trilon® BS.
Product Specifications
Color: Colorless to Yellowish
pH: value: 10-11
Pour Point: -24 °C
Onset Boiling: 100 °C
Vapor Pressure: 23.4 mbar
Density: 1.05g/cm3
Primary Chemistry: N,N,N′,N′-Tetrakis(2-Hydroxypropyl) Ethylenediamine
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BASF Metal Surface Treatment
BASF metal finishing additives line comprises a range of chemistries, including 2-butyne-1,4-diol ethoxylate and ethoxylated fatty alcohols, typically used in metal surface preparation, plating, post-treatment, or finishing, and offer improved brightening, emulsification, antifoaming, corrosion, inhibition, chelation, oxidization for metal removal, and passivation benefits.
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