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Single Component Fluorinated Polymer in Novec™ 7200 Engineered Fluid for printed circuit boards and electronics manufacturing
Appearance: Transparent-yellow liquid
Solids: 1% wt. fluorinated polymer
Solvent: 3M™ Novec™ 7200 Engineered Fluid
Density: 1.41 g/mL
Viscosity: 0.7 cP
Boiling Point: 77°C (170°F);
Novec™ 2701 is a highly engineered yet easy-to-use solution for long-term moisture and corrosion protection on circuit boards and other printed electronic components. Novec™ 2701 is formulated with a high-purity fluorinated polymer suspended in a hydrofluoroether base solvent (Novec™ 7200) that provides complete film coverage without a secondary curing phase.
Ineffective Surface Wetting or Coverage
Electric or Thermal Instability in Coating Film
Poor Water Repellency or Resistance
Novec™ 2701 is well suited for a range of applications requiring high levels of moisture and corrosion control.
Novec™ 2701 can be applied through dipping, spray, and syringe dispersal methods.
Strategically located across North America and EMEA for fast, reliable delivery. Every order, every time.
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Current Region: English - United States