UCON™ Solder Assist Fluid 10

Polyalkylene Glycol-based Solder Assist Fluid Ideal for Formulations Used in Printed Circuit Board Manufacturing Assembly Enhanced with Thermal Stability & Flash Point Additives.
Product Overview
UCON™ Solder Assist 10 is a water soluble, PAG-based fluid with good inherent thermal stability and high flash point. UCON™ Solder Assist 10 has good water washability and is suitable as a component in solder reflow fluids, fluxes and fusing fluids.
Product Specifications
Viscosity, cSt @ 40°C: 280
Specific Gravity, 20/20°C: 1.088
Pour Point, °C (°F): -15 (5)
Flash Point, Closed Cup: 177 (350)
Flash Point, Open Cup: 318 (605)
Surface Tension, Dynes/cm: 38.7
Water Solubility, 25°C: Complete
Cloud Point, 1% Aqueous Soln., °C (°F): 85 (185)
Primary Chemistry: Polyalkylene glycol
Features & Benefits
High flash point
Water Soluble
Excellent Wash-ability
Good Thermal Stability
Low Odor & Low Toxicity
Low Foam Tendency
Problems Solved
Poor Rinse or Wash Ability in Solder Flux or Fluid
Hazy or Opaque Solder Fluid Clarity
Premature Solder Oxidation
UCON™ Solder Assist 10 is engineered for soldering processes during the Fabrication & Assembly of Printed Circuit Boards.