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UCON™ Solder Assist Fluid 10
UCON™ Solder Assist 10 is a high-quality polyalkylene glycol–based solder assist fluid ideal for formulations used in printed circuit board manufacturing assembly.
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- Manufacturer: Dow
- Product Line: UCON™ Polyalkylene Glycol Formulated Fluids
- Product: UCON™ Polyalkylene Glycol Solder Assist Fluids
- Industries: Maintenance, Repair, Overhaul | Metal Processing & Fabrication
- Authorized Countries: Canada | Mexico | United States
Fulfilled By ChemPoint
Fulfilled By ChemPoint
Manufacturer
Product Line
Authorized Countries
Canada
Mexico
United States
Overview
UCON™ Solder Assist 10 is a water-soluble, PAG-based fluid with a good inherent thermal profile, oxidative stability, and a high flash point. This high-performance material is suitable as a component in solder reflow, flux, and fusing fluids, as well as electronic applications. It improves solder joint quality by preventing and cleaning the formation of oxides and flux residues on the surface of metals formed during the soldering process. This biodegradable chemical is formulated free of halogens, heavy metals, and other harmful compounds, making it environmentally friendly. UCON™ Solder Assist 10 has a viscosity of 280 cSt at 40°C.
The formula for UCON™ Solder Assist 10 is enhanced with performance additives for excellent thermal stability and a high flash point and delivers a low-toxicity synthetic soldering material. UCON™ Solder Assist 10 is completely soluble in water as it contains zero water-insoluble additives.
Specifications
Viscosity, cSt @ 40°C: 280
Specific gravity, 20/20°C: 1.088
Pour point, °C (°F): −15 (5)
Flash point, closed cup, °C (°F): 177 (350)
Flash point, open cup, °C (°F): 318 (605)
Surface tension, dynes/cm: 38.7
Water solubility, 25°C: Complete
Cloud point, 1% aqueous soln., °C (°F): 85 (185)
Primary Chemistry: Polyalkylene glycol
Features & Benefits
- High flash and fire points
- Water soluble
- Excellent washability
- Oxidative stability
- Excellent temperature profile
- Low odor and low toxicity
- Biodegradable
- Low foam tendency
- Improved solder joint quality
- Extended soldering iron life
- Noncorrosive
- Nonflammable
- Free of halogens and heavy metals
Problems Solved
Poor rinsability or washability in solder flux or fluid Hazy or opaque solder fluid clarity Premature solder oxidation Damage from corrosion, high temperatures, or oxidation Excess solder and flux residue
Applications
UCON™ Solder Assist 10 is engineered for a variety of applications, including: Soldering fluids, fluxes, and fusing fluids Fabricating and assembling printed circuit boards Electronic and repair applications Cleaning excess solder and flux residues from the system
Related Applications
Maintenance, Repair, Overhaul
Related Chemistries
Maintenance, Repair, Overhaul
Related End Markets
Related Functions
Maintenance, Repair, Overhaul
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