UCON™ Solder Assist Fluid 25 (SAF-25) is a high-performance, biodegradable, polyalkylene glycol (PAG) based fluid specially designed for solder reflow fluids, fluxes, fusing fluids, and other process fluids where superior thermal and oxidative stability and low foam tendency are critical.
UCON™ Solder Assist Fluid 25 (SAF-25) is a low-viscosity, water-soluble PAG-based fluid for use in a variety of applications, including as a component in reflow, flux, and fusing fluids in soldering processes. This biodegradable, high-performance solder assist fluid provides good thermal and oxidative stability and excellent water washability. Its high flash and fire points make it ideal for printed circuit board manufacturing and assembly.
UCON™ Solder Assist Fluid 25 has a viscosity of 90 cSt at 40°C.
Viscosity, cSt @ 40°C: 90
Specific gravity, 20/20°C: 1.151
Pour point, °C (°F): −34 (−29)
Flash point, closed cup: 182 (360)
Flash point, open cup: 279 (535)
Surface tension, dynes/cm: 37.8
Water solubility, 25°C: Complete
Cloud point, 1% aqueous solution, °C (°F): >99 (>210)
Primary Chemistry: Polyalkylene glycol (PAG)
Primary Chemistry: Polyalkylene glycol
Film or deposit formation on circuit board
Inferior thermal stability or breakdown in flux fluid
Strong odor
Excessive foam formation
Poor product clarity
Film or Deposit Formation on Circuit Board
Inferior Thermal Stability or Breakdown in Flux Fluid
UCON™ Solder Assist Fluid 25 is recommended for use in the following:
Fabrication and assembly of printed circuit boards
Solder resist ink
Formulated products
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