Select Your Region
UCON™ Solder Assist Fluid 25
UCON™ Solder Assist Fluid 25 (SAF-25) is a high-performance, biodegradable, polyalkylene glycol (PAG) based fluid specially designed for solder reflow fluids, fluxes, fusing fluids, and other process fluids where superior thermal and oxidative stability and low foam tendency are critical.
Quantity
Documents
- Manufacturer: Dow
- Product Line: UCON™ Polyalkylene Glycol Formulated Fluids
- Product: UCON™ Polyalkylene Glycol Solder Assist Fluids
- Industries: Maintenance, Repair, Overhaul | Metal Processing & Fabrication
- Authorized Countries: Canada | Mexico | United States
Fulfilled By ChemPoint
Fulfilled By ChemPoint
Manufacturer
Product Line
Authorized Countries
Canada
Mexico
United States
Overview
UCON™ Solder Assist Fluid 25 (SAF-25) is a low-viscosity, water-soluble PAG-based fluid for use in a variety of applications, including as a component in reflow, flux, and fusing fluids in soldering processes. This biodegradable, high-performance solder assist fluid provides good thermal and oxidative stability and excellent water washability. Its high flash and fire points make it ideal for printed circuit board manufacturing and assembly.
UCON™ Solder Assist Fluid 25 has a viscosity of 90 cSt at 40°C.
Specifications
Viscosity, cSt @ 40°C: 90
Specific gravity, 20/20°C: 1.151
Pour point, °C (°F): −34 (−29)
Flash point, closed cup: 182 (360)
Flash point, open cup: 279 (535)
Surface tension, dynes/cm: 37.8
Water solubility, 25°C: Complete
Cloud point, 1% aqueous solution, °C (°F): >99 (>210)
Primary Chemistry: Polyalkylene glycol (PAG)
Primary Chemistry: Polyalkylene glycol
Features & Benefits
- Film or deposit formation on circuit board
- Inferior thermal stability or breakdown in flux fluid
- Strong odor
- Excessive foam formation
- Poor product clarity
Problems Solved
Film or Deposit Formation on Circuit Board
Inferior Thermal Stability or Breakdown in Flux Fluid
Applications
UCON™ Solder Assist Fluid 25 is recommended for use in the following: Fabrication and assembly of printed circuit boards Solder resist ink Formulated products
Related Applications
Maintenance, Repair, Overhaul
Related Chemistries
Maintenance, Repair, Overhaul
Related End Markets
Metal Processing & Fabrication
Related Functions
Maintenance, Repair, Overhaul
Have questions? Can't find the right product?
Ask our Experts
Have questions? Can't find the right product?
Ask our ExpertsWhen You're Ready
Get a Quote
Ask a Question
Request a Sample
Request a Document
Document Download
Thank you
Your document download will begin shortly.
ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
Thank you
Thank you for your inquiry and interest in ChemPoint.
We will respond to you shortly.
ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
Thank you
Thank you for your inquiry and interest in ChemPoint.
We will respond to you shortly.
ChemPoint will not under any circumstances release personal user information to individuals or companies. All information collection is solely used to support ChemPoint customers service communications. Read our Privacy Notice.
Document Download
The document currently is provided in the following languages from the supplier at this time.
Document Download
The document currently is provided in the following languages from the supplier at this time.
Are you in the correct region?
We’ve detected that you are located in a different region than the region selected on the website. Would you like to change your region?
Current Region: English - United States
