Select Your Region
jER™ YL983U
jER™ YL983U is a bisphenol F, liquid-type epoxy resin with very low chlorine content that exhibits excellent adhesiveness, good elastic recovery, electrical insulation, and resistance to chemicals, heat, and water. It can be used for various applications, including electrical and electronic applications, such as sealants, casting agents, and adhesives, as well as potting and encapsulation materials.
Documents
- Manufacturer: Mitsubishi Chemical Group
- Product Line: jER™ Epoxy Resins
- Product: jER™ Thermosetting Epoxy Resins
- Industries: Adhesives | Coatings | Maintenance, Repair, Overhaul
- Authorized Countries: United States
Note: Product Fulfillment Provided by the Producer
Note: The producer provides fulfillment and controls personal data. ChemPoint mediates to share data with the producer.
Manufacturer
Product Line
Product
Industries
Authorized Countries
United States
Overview
jER™ YL983U is a bisphenol F-type liquid epoxy resin with low chlorine content and low viscosity. It exhibits excellent adhesiveness, good elastic recovery, electrical insulation, and resistance to chemicals, heat, and water, making it optimal for electrical and electronic applications, such as sealants, casting agents, and adhesives, as well as potting and encapsulation materials.
Specifications
Epoxy equivalent weight (WPE): 165–175g/eq
Viscosity @ 25°C: 30–60 P
Saponifiable Cl: 0–50 ppm
Harsh hydrolyzable Cl: ≤200 pm
Appearance: Pale yellow transparency
Density @ 25°C: 1.2 g/cm3
CAS: 9003-36-5
Features & Benefits
- Bisphenol F-type liquid epoxy resin
- Very low chlorine content
- Low viscosity
- Excellent adhesiveness
- Good elastic recovery
- Chemical, heat, and water resistant
- Electrical insulating properties
Problems Solved
Damage to coatings caused by exposure to weather, chemicals, or water
Resin shifting or distortion from water
Cracking and surface defects of coatings used on flexible substrates
Applications
Electrical and electronic applications (sealants, casting agents, adhesives, etc.)
Potting and encapsulation materials
Adhesives
Liquid underfill/adhesive for semiconductor package, especially when low viscosity is needed
Compatible with metal, aluminum, concrete, masonry, glass, fibers, fabrics, plastics, steel, and ceramic
Related Applications
Adhesives
- Architectural
- Ceramics
- Industrial
- Machinery & Appliances
- Packaging
- Paper & Consumables
- Sealants
- Textiles
Related Chemistries
Maintenance, Repair, Overhaul
Related Functions
Related Technologies
Adhesives
jER™ Epoxy Resins Articles
Explore jER™ Specialty Epoxy Resins
jER™ specialty epoxy resins are engineered to provide maximum performance in modern formulations used in the evolving electronics manufacturing space.
Have questions? Can't find the right product?
Ask our Experts
Have questions? Can't find the right product?
Ask our ExpertsWhen You're Ready
When You're Ready
View Support Articles
Talk to an Expert
Ask a Question
Are you in the correct region?
We’ve detected that you are located in a different region than the region selected on the website. Would you like to change your region?
Current Region: English - United States
