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UCON™ Solder Assist Fluid 24
UCON™ Solder Assist Fluid 24 is a medium-viscosity polyalkylene glycol–based fluid formulated for solder reflow fluids, fluxes, fusing fluids, and other process fluids where high temperature, oxidative stability and a low foaming tendency are crucial.
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- Manufacturer: Dow
- Product Line: UCON™ Polyalkylene Glycol Formulated Fluids
- Product: UCON™ Polyalkylene Glycol Solder Assist Fluids
- Industries: Maintenance, Repair, Overhaul | Metal Processing & Fabrication
- Authorized Countries: Canada | Mexico | United States
Fulfilled By ChemPoint
Fulfilled By ChemPoint
Manufacturer
Product Line
Authorized Countries
Canada
Mexico
United States
Overview
UCON™ Solder Assist Fluid 24 is a medium-viscosity, water-soluble polyalkylene glycol–based (PAG) fluid that provides excellent thermal and oxidative stability as well as water washability. Its high flash point and product clarity make it ideal for printed circuit board manufacturing and assembly.
This high-performance synthetic solution is also particularly well suited for various industrial applications, including as a component in reflow, flux, and fusing fluids in soldering processes. UCON™ Solder Assist Fluid 24 has a viscosity of 123 cSt at 40°C. This low-toxicity soldering fluid is completely soluble in water as it contains zero water-insoluble additives.
Specifications
Product Type: Soldering Lubricant
Viscosity, cSt @ 40°C: 123
Specific gravity, 20/20°C: 1.139
Pour point, °C (°F): −5 (23)
Flash point, closed cup, °C (°F): 268 (515)
Flash point, open cup, °C (°F): 218 (425)
Surface tension, dynes/cm: 45.5
Water solubility, 25°C: Complete
Cloud point, 1% aqueous soln., °C (°F): >99 (>210)
Primary Chemistry: Polyalkylene glycol (PAG)
Primary Chemistry: Polyalkylene glycol
Features & Benefits
- Good thermal stability
- High flash point
- Excellent water washability
- Low foaming tendency
- Biodegradable
- Low toxicity and low odor
- High product clarity
- Contains zero water-insoluble additives
Problems Solved
Undesired residue, additive deposit, or film on the circuit board High foam formation in the soldering process Strong odor Excessive foam formation Poor temperature stability Oxidation Poor product clarity Risk of toxins
Applications
UCON™ Solder Assist Fluid 24 can be used in the following applications: Fabrication and assembly of printed circuit boards Solder resist ink Formulated products
Related Applications
Maintenance, Repair, Overhaul
Related Chemistries
Maintenance, Repair, Overhaul
Related End Markets
Related Functions
Maintenance, Repair, Overhaul
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