UCON™ Solder Assist Fluid 24 is a medium-viscosity polyalkylene glycol–based fluid formulated for solder reflow fluids, fluxes, fusing fluids, and other process fluids where high temperature, oxidative stability and a low foaming tendency are crucial.
UCON™ Solder Assist Fluid 24 is a medium-viscosity, water-soluble polyalkylene glycol–based (PAG) fluid that provides excellent thermal and oxidative stability as well as water washability. Its high flash point and product clarity make it ideal for printed circuit board manufacturing and assembly.
This high-performance synthetic solution is also particularly well suited for various industrial applications, including as a component in reflow, flux, and fusing fluids in soldering processes. UCON™ Solder Assist Fluid 24 has a viscosity of 123 cSt at 40°C. This low-toxicity soldering fluid is completely soluble in water as it contains zero water-insoluble additives.
Product Type: Soldering Lubricant
Viscosity, cSt @ 40°C: 123
Specific gravity, 20/20°C: 1.139
Pour point, °C (°F): −5 (23)
Flash point, closed cup, °C (°F): 268 (515)
Flash point, open cup, °C (°F): 218 (425)
Surface tension, dynes/cm: 45.5
Water solubility, 25°C: Complete
Cloud point, 1% aqueous soln., °C (°F): >99 (>210)
Primary Chemistry: Polyalkylene glycol (PAG)
Primary Chemistry: Polyalkylene glycol
Good thermal stability
High flash point
Excellent water washability
Low foaming tendency
Biodegradable
Low toxicity and low odor
High product clarity
Contains zero water-insoluble additives
Undesired residue, additive deposit, or film on the circuit board
High foam formation in the soldering process
Strong odor
Excessive foam formation
Poor temperature stability
Oxidation
Poor product clarity
Risk of toxins
UCON™ Solder Assist Fluid 24 can be used in the following applications:
Fabrication and assembly of printed circuit boards
Solder resist ink
Formulated products
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