UCON™ Solder Assist Fluid 26

Low Viscosity Polyalkylene Glycol-based Fluid for Use in Solder Reflow Fluids, Fluxes, Fusing Fluids, and Other Process Fluids Where High Temperature Stability and Water Solubility are Critical. Enhanced with Performance Additives for Thermal Stability.
Product Overview
UCON™ Solder Assist Fluid 26 is a low viscosity, water soluble PAG fluid with performance additives to improve thermal stability & flash point. UCON™ Solder Assist Fluid 26 is suitable as a component in solder reflow fluids, fluxes and fusing fluids.
Product Specifications
Viscosity, cSt @ 40°C: 90
Specific Gravity, 20/20°C: 1.152
Pour Point, °C (°F): <-34 (<-30)
Flash Point, Closed Cup: 279 (535)
Flash Point, Open Cup: 310 (590)
Surface Tension, Dynes/cm: 38.1
Water Solubility, 25°C: Complete
Cloud Point, 1% Aqueous Soln., °C (°F): >99 (>210)
Primary Chemistry: Polyalkylene glycol
Features & Benefits
Good thermal stability
High flash point
Excellent water washability
Low foam rendency
Biodegradable, low toxicity
Low odor
High product clarity
Problems Solved
Film or Deposit Formation on Circuit Board
Inferior Thermal Stability or Breakdown in Flux Fluid
Applications
UCON™ Solder Assist Fluid 26 is a performance fluid for use during the Fabrication & Assembly of Printed Circuit Boards.