ISO 100 polyalkylene glycol fluid, designed for use in solder reflow fluids, fluxes, fusing fluids, and other process fluids needing high temperature stability.
Low viscosity, water soluble PAG, additive improves stability at high temperatures and raises its flash point. Suitable as component in solder reflow fluids, fluxes and fusing fluids.
Viscosity, cSt @ 40°C: 90
Specific Gravity, 20/20°C: 1.152
Pour Point, °C (°F): <-34 (<-30)
Flash Point, Closed Cup: 279 (535)
Flash Point, Open Cup: 310 (590)
Surface Tension, Dynes/cm: 38.1
Water Solubility, 25°C: Complete
Cloud Point, 1% Aqueous Soln., °C (°F): >99 (>210)
Primary Chemistry: Polyalkylene glycol
Good thermal stability
High flash point
Excellent water washability
Low foam rendency
Biodegradable, low toxicity
High product clarity
Solder is Used During the Fabrication & Assembly of Printed Circuit Boards.
UCON™ polyalkylene glycol formulated fluids include calendar lubricants, coatings fluids, hydraulic fluids, metal working fluids, solder assist fluids, defoamers, textile rubber fluids, and food grade lubricants.
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