UCON™ Solder Assist Fluid 26 is a biodegradable, low toxicity polyalkylene glycol (PAG)-based chemical specially designed for use in solder reflow fluids, fluxes, fusing fluids, and other process fluids where superior water solubility and a wide temperature profile is critical.
UCON™ Solder Assist Fluid 26 (SAF-26) is a low-viscosity, water-soluble PAG fluid specially formulated with performance additives to improve your product's thermal stability and flash point. This high-performance solder assist fluid is suitable as a component in reflow fluid, flux, and fusing fluid soldering processes. It provides good temperature and oxidative stability, in addition to excellent water washability to prevent film or deposit formation.
The high flash and fire points of UCON™ SAF-26 make it ideal for use in printed circuit board manufacturing and assembly. UCON™ Solder Assist Fluid 26 has a viscosity of 90 cSt at 40°C.
Viscosity, cSt @ 40°C: 90
Specific gravity, 20/20°C: 1.152
Pour point, °C (°F): <-34 (<-30)
Flash point, closed cup: 279 (535)
Flash point, open cup: 310 (590)
Surface tension, dynes/cm: 38.1
Water solubility, 25°C: Complete
Cloud point, 1% aqueous solution, °C (°F): >99 (>210)
Primary Chemistry: Polyalkylene glycol (PAG)
Primary Chemistry: Polyalkylene glycol
Good thermal stability
High flash point
Excellent water washability
Low foam rendency
Biodegradable, low toxicity
Low odor
High product clarity
Film or deposit formation on circuit board
Inferior thermal stability or breakdown in flux fluid
Strong odor
Excessive foam formation
Poor product clarity
UCON™ Solder Assist Fluid 26 is recommended for use in the following:
Fabrication & assembly of printed circuit boards
Solder resist ink
Formulated products
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