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- Manufacturer: Dow
- Product Line: Dow PARALOID™ Impact Modifiers
- Product: PARALOID™ BTA Impact Modifiers
- Industries: Adhesives | Plastics
- Authorized Countries: Canada | United States
PARALOID™ TMS-2672
PARALOID™ TMS-2672 is an MBS core-shell impact modifier that easily disperses and improves the brittle mechanical behavior of thermosetting resins while maintaining lightweight properties and improved adhesion.
Quantity
Documents
Specifications
Form: Powder
Color: White
Bulk density aerated, g/cm³: 0.41 ± 0.10
Volatiles, % max: ≤1.0
Primary Chemistry:
Acrylic copolymer and alkylated phenol
- Manufacturer: Dow
- Product Line: Dow PARALOID™ Impact Modifiers
- Product: PARALOID™ BTA Impact Modifiers
- Industries: Adhesives | Plastics
- Authorized Countries: Canada | United States
Manufacturer
Product Line
Product
Authorized Countries
Canada
United States
Overview
PARALOID™ TMS-2672 is a patented MBS core-shell impact modifier designed to enhance the mechanical performance of thermosetting adhesives, especially epoxy and methyl methacrylate (MMA) systems. PARALOID™ TMS-2672 improves impact resistance, elongation at break, and fatigue strength while maintaining low viscosity and lightweight properties. This grade disperses quickly and uniformly in liquid-curable resins, making it ideal for structural adhesives used in demanding applications across automotive, aerospace, electronics, and marine industries.
Specifications
Form: Powder
Color: White
Bulk density aerated, g/cm³: 0.41 ± 0.10
Volatiles, % max: ≤1.0
Primary Chemistry:
Acrylic copolymer and alkylated phenol
Features & Benefits
- Fast and easy dispersion in epoxy and MMA adhesives
- Maintains low viscosity for efficient processing
- Enhances impact strength at ambient and low temperatures
- Increases elongation at break and fatigue resistance
- Improves adhesion to various substrates
- Retains glass transition temperature of the base resin
- Lightweight additive for structural applications
Problems Solved
Brittleness in thermoset adhesives
Poor impact and tensile strength in epoxy and MMA systems
Limited fatigue and elongation resistance in structural bonding applications
Dispersion challenges in liquid-curable resins
Applications
Structural adhesives (epoxy and MMA)
Fiberglass composite bonding
Coating and casting adhesives
Wind turbine blade bonding
Automotive body panel adhesives
Aerospace structural bonding
Marine and recreational vehicle adhesives
Electronics encapsulation and assembly
Related Applications
Related Chemistries
Related End Markets
Related Functions
Adhesives
Plastics
Related Processes
Dow PARALOID™ Impact Modifiers Articles
Dow PARALOID™ Composite Infrastructure
years. By incorporating Dow PARALOID™ MBS Impact Modifiers, companies can increase capacity, transmission, and distribution of the existing electrical grid, as well as improve reliability and the ability to recover from outages.
FAQs
Is PARALOID™ TMS-2672 easy to disperse in liquid epoxy resins?
Yes. PARALOID™ TMS-2672 was designed to readily disperse in liquid epoxy resins as its core shell rubber technology supports uniform dispersion in epoxy systems.
Can PARALOID™ TMS-2672 be used at low loading levels?
Yes. PARALOID™ TMS-2672 can deliver improvements in toughness at relatively low loading levels, allowing formulators to enhance performance without significantly increasing viscosity or altering the formulation balance.
Does PARALOID™ TMS-2672 affect curing behavior in epoxy systems?
No. PARALOID™ TMS-2672 was formulated to retain key epoxy properties, including thermal performance and glass transition temperature, while improving toughness.
How does PARALOID™ TMS-2672 affect glass transition temperature (Tg) in epoxies?
PARALOID™ TMS-2672 was designed to improve epoxy toughness while retaining the glass transition temperature (Tg) of the cured system. The core shell rubber technology enhances toughness and fatigue resistance without significantly reducing Tg or thermal performance, unlike some traditional rubber tougheners.
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