CAB-551-0.01

CAB-551-0.01 has the highest butyrate content and lowest molecular weight of the CAB series.  The low molecular weight allows for high solids coatings to be formulated while maintaining a worakble viscosity.  The butyrate content of CAB-551-0.01 lends to excellent flexibility as well as compatibility with a very wide range of solvents, resins and even monomers.  It is soluble in common acrylic monomers and styrene and can therefore be used in 100% solid reactive coatings and inks. When used in UV curable inks and coatings, CAB-551-0.01 improves leveling, gloss, and hardness.  It also helps to reduce the amount of shrinkage due to cross-linking and curing.  CAB-551-0.01 can be used by pultruders to enable higher pultrusion speed and prevent internal/external cracking.  When formulated into coatings CAB-551-0.01 improves UV stability, flow, leveling, pigment orientation and durability.  CAB-551-0.01 can be blended with CAB-381 at a ratio of 1:8 and be used as a film forming polymer system in protective coatings for nail polish.  When used in nail polish formulations as a film former, CAB-551-0.01 provides sag resistance and easy application in addition to UV resistance, gloss, and fast drying speeds.  In addition, CAB-551-0.01 can be used as a additive in UV and LED curable nail polish to make removal of the gel coat easier.  In an experiment to test this, Eastman found that a reduction of acetone soak removal time of over 10 minutes is achievable by adding 9% by weight CAB-551-0.01 to the formulation.